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WT 5912-15 Thermal pad


WT 5912-15 The main application scenarios of thermal pads are between the internal chips and heat sinks of vibration sensitive handheld, wearable, and mobile terminal products; It can also be applied between the casings of some electronic products, providing functions such as heat dissipation, insulation, dust prevention, and waterproofing. It has the characteristics of low hardness, better interface filling, and can be reused multiple times.


▶ Typical Application1531184831155139.jpg

 High end equipments and automotive electronic coolings and heating components, such as electronic devices, semiconductor memory devices, etc

● General-purpose inverters, Medical equipments, Digital Signal Controllers

● Automotive electronics, such as on-board cameras, motor control units, automotive navigation, automotive lighting (LED), Dynamic Stability Controls

● Laser HUD light source

● Consumer microelectronics and hand held electronic devices

● Base station, IGBT module


▶ Parameter Index

Index

Test Standards

Data

Color

/

Green/Grayish white

Thickness (mm)

ASTM D374

0.5~4.0

Thermal conductivityW/(m·K)

ASTM D5470

1.5

Hardness (Shore OO)

ASTM D2240

28/35/55

Volume resistivity(Ω·cm)

ASTM D257

1.0×1010

Density (g/cm³)

ASTM D792

2.4

Breakdown voltage (kV/mm)

ASTM D149

8

Temperature range (℃)


-50~150

Flame retardant rating

UL94

V-0

Customized options

Single-side treatment/ single-side additional adhesive/                  fiberglass reinforcement


▶ Function and Characteristics

● Easy to use, easy to remove, excellent insulation performance, excellent resilience performance

● Excellent flexibility: can be perfectly embed uneven interface

● High applicability: stable performance at -50 ~ 150 ℃

● Excellent flame performance: meet UL94-V0 level

● RoHS, REACH comliance


▶ Dimension

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▶ Remarks

‌Waermtimo reserves the final amendment rights to product specifications and documentation.