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Product

WT 5907-5560 Thermal conductive adhesive


WT 5907-5560 Thermal conductive adhesive is used for good vertical thermal conductivity and bonding between heat sources (CPUs or electronic chipsets) and heat sinks. Curing does not produce by-products and is environmentally friendly.


1747452856433913.jpg▶ Function and Characteristics

● Thermal interface performance:2.2W/(m·K)

● Maintain excellent shear strength even under sustained high temperatures

● The operating temperature can reach 230 ℃

● Good flame retardant performance: meets UL94 standard V-0 level

● RoHS、REACH Compliance


▶ Parameter Index

Index

Test Standards

Data

Color

/

Grey

Viscosity (pa·s)

/

50

Thermal conductivity (W/(m·K))

ASTM D5470

2.2

Hardness (Shore A)

ASTM D2240

85

Tensile strengthMpa

ASTM D412

3

Shear strength                       MPa Al-Al

ASTM D1002

3.5

Volume   resistivity (Ω·cm)

ASTM D257

1.0×1012

Density (g/cm³)

ASTM D792

3.0

Breakdown   voltage  (kV/mm)

ASTM D149

                     >8

Temperature range (℃)

              /

-50~200

Flame retardant rating

UL94

V-0

Curing condition

/

               150℃ 30min


▶ Typical Application

image.png High-end equipments and automotive electronics, cooling heating components, such as electronic devices, semiconductor memory devices, etc

● Thermal conductivity between chip interfaces

● Automotive electronics, such as on-board cameras, motor control units, automotive navigation, automotive lighting (LED)

● Laser HUD light source

● Consumer microelectronics and hand held electronic devices(like mobile phones, computers, etc)

● Base station, IGBT modules


▶ Packaging Specification

30ml/tube      50ml/tube      1kg/can


▶ Storage

Storage temperature below 5 ℃, shelf life of 6 months


▶ Remarks

Waermtimo reserves the final amendment rights to product specifications and documentation.