Product
Product
WT 5902-50 Thermal pad
WT 5902-50 Thermal pad can solve the problem of tolerance changes when design product structure, and can be reused. It is a good vertical thermal conduction material between the heat source (CPU or electronic chipset) and the heat sink. Easy to use and rework.
▶ Typical Application
● High end equipments and automotive electronic coolings and heating components, such as electronic devices, semiconductor memory devices, etc
● General-purpose inverters, Medical equipments, Digital Signal Controllers
● Automotive electronics, such as on-board cameras, motor control units, automotive navigation, automotive lighting (LED), Dynamic Stability Controls
● Laser HUD light source
● Consumer microelectronics and hand held electronic devices
● Base station, IGBT module
▶ Parameter Index
Index | Test Standards | Data |
Color | / | Grey |
Thickness (mm) | ASTM D374 | 0.3~4.0 |
Thermal conductivity（W/(m·K)） | ASTM D5470 | 5.0 |
Hardness (Shore OO) | ASTM D2240 | 25/40/55/60/70 |
Volume resistivity （Ω·cm） | ASTM D257 | 1.0×1010 |
Density (g/cm³) | ASTM D792 | 3.3 |
Breakdown voltage (kV/mm) | ASTM D149 | ＞7 |
Temperature range (℃) | -50~150 | |
Flame retardant rating | UL94 | V-0 |
Customized options | Single-side treatment/ single-side additional adhesive/ fiberglass reinforcement/ PI reinforcement | |
▶ Function and Characteristics
● High thermal interface performance:5W/(m·K)
● Excellent flexibility: can be perfectly embed uneven interface
● High applicability: stable performance at -50 ~ 150 ℃
● Excellent flame retardant performance: meet UL94-V0 level
● RoHS, REACH comliance
▶ Dimension
▶ Remarks
Waermtimo reserves the final amendment rights to product specifications and documentation.
