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WT 5902-200 Thermal pad


WT 5902-200 The main application scenarios of thermal pads are between the internal chips and heat sinks of vibration sensitive handheld, wearable, and mobile terminal products; It can also be applied between the casings of some electronic products, providing functions such as heat dissipation, insulation, dust prevention, and waterproofing. It has the characteristics of low hardness, better interface filling, and can be reused multiple times.


▶ Typical Application1531378953744543.jpg

 High end equipments and automotive electronic coolings and heating components, such as electronic devices, semiconductor memory devices, etc

● General-purpose inverters, Medical equipments, Digital Signal Controllers

● Automotive electronics, such as on-board cameras, motor control units, automotive navigation, automotive lighting (LED), Dynamic Stability Controls

● Laser HUD light source

● Consumer microelectronics and hand held electronic devices

● Base station, IGBT module


▶ Parameter Index

Index

Test Standards

Data

Color

/

Grey

Thickness (mm)

ASTM D374

1.0~4.0

Thermal   conductivity W/(m·K)
  Rui Ling
LW-9389

ASTM D5470

20.0

Thermal   conductivity W/(m·K)
 
Hot Disk conductometer

ISO 22007

20.0

Hardness (Shore   OO)

ASTM D2240

65

Volume   resistivity Ω·cm

ASTM D257

1.0×1010

Density (g/cm³)

ASTM D792

3.4

Breakdown   voltage (kV/mm)

ASTM D149

7

Temperature   range (℃)

/

-50~150

Flame retardant   rating

UL94

V-0

Customized   options

Single-side   treatment/ single-side additional adhesive

▶ Function and Characteristics

● Easy to use, easy to remove, excellent insulation performance, excellent resilience performance

● Excellent flexibility: can be perfectly embed uneven interface

● High applicability: stable performance at -50 ~ 150 ℃

● Excellent flame retardant performance: meet UL94-V0 level

● RoHS, REACH comliance


▶ Dimension

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▶ Remarks

Waermtimo reserves the final amendment rights to product specifications and documentation.