Product
Product
WT 5921-30 Low Si-oil Leakage Thermal Gel/Mud
WT 5921-30 Thermal Gel is also called Thermal mud. It made by silicon resin substrate, adding thermal conductive filler and binder material. It has excellent weather resistance, excellent dielectric properties and wide working temperature.
FEATURES
l Density: 3.2 g/cm³
l High thermal interface performance: 3 W/(m·K)
l Excellent flexibility: can be perfectly embed in uneven interface
l High applicability: stable performance under -50~150℃
l Excellent flame retardant performance: meet UL94-V0 level
l Meet RoHS, REACH standard
APPLICATION
l Power supply and semiconductor
l Automotive electronic control
l Communication electric equipments
l Memory and power modules
l Microprocessor / graphics processor
l Flat panel display, computer
l Consumer electronics products
